000			02198nam a22003617a 4500
001			102698
003			KnowledgeUnlatched
005			20210303105048.0
006			m o d
007			cr u||||||||||
008			210129p20092019flu o u00| u eng d
037			_5BiblioBoard
245	0	0	_aNanoparticle Engineering for Chemical-Mechanical Planarization _bFabrication of Next-Generation Nanodevices / _cJea-Gun Park, Ungyu Paik.
020			_a9781420059113
029	1		_ahttps://library.biblioboard.com/ext/api/media/d3662c37-f405-4c54-ac91-34b3f72a2396/assets/thumbnail.jpg
040			_aScCtBLL _cScCtBLL
100	1		_aPark, Jea-Gun _eauthor.
506	0		_aAccess copy available to the general public. _fUnrestricted _2star
700	1		_aPaik, Ungyu _eauthor.
264		1	_bCRC Press,
300			_a1 online resource (222 p.)
520			_aIncreasing reliance on electronic devices demands products with high performance and efficiency. Such devices can be realized through the advent of nanoparticle technology. This book explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. This comprehensive text also presents design techniques using polymeric additives to improve CMP performance.
588	0		_aDescription based on print version record.
590			_aKU Select 2018: STEM Backlist Books
650		7	_aTechnology & Engineering / Nanotechnology & Mems _2bisacsh
650		0	_aTechnology
655		0	_aElectronic books.
758			_iIs found in: _aKnowledge Unlatched _1https://openresearchlibrary.org/module/2774bc74-146a-484f-a7ba-ab1d6a09bbfb
856	4	0	_uhttps://openresearchlibrary.org/content/d3662c37-f405-4c54-ac91-34b3f72a2396 _zView this content on Open Research Library. _70
999			_c33448 _d33448